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-0- specifications for nichia bluish-green led model : NSPE310S nichia corporation nichia sts-da1-1102
-1- 1.specifications (1) absolute maximum ratings (ta=25c) item symbol absolute maximum rating unit forward current i f 35 ma pulse forward current i fp 110 ma reverse voltage v r 5 v power dissipation p d 120 mw operating temperature t opr -30 ~ + 85 c storage temperature t stg -40 ~ +100 c soldering temperature t sld 265c for 10sec. i fp conditions : pulse width 10msec. and duty 1/10 (2) initial electrical/optical characteristics (ta=25c) item symbol condition typ. max. unit forward voltage v f i f =10[ma] (3.1) 3.45 v reverse current i r v r = 5[v] - 50 a luminous intensity iv i f =10[ma] (5.5) - cd x - i f =10[ma] 0.085 - - chromaticity coordinate y - i f =10[ma] 0.490 - - ? forward voltage measurement allowance is 0.05v. ? luminous intensity value is traceable to the cie 127:2007-compliant national standards. ? please refer to cie 1931 chromaticity diagram. (3) ranking (ta=25c) item symbol condition min. max. unit rank w 6.4 9.2 rank v 4.6 6.4 luminous intensity rank u iv i f =10[ma] 3.2 4.6 cd ? luminous intensity measurement allowance is 10%. color ranks (i f =10ma,ta=25c) rank c rank d x 0.04 0.04 0.12 0.12 x 0.05 0.05 0.13 0.13 y 0.39 0.49 0.49 0.39 y 0.48 0.58 0.58 0.48 rank e x 0.06 0.06 0.14 0.14 y 0.55 0.65 0.65 0.55 ? color coordinates measurement allowance is 0.012. ? basically, a shipment shall consist of the leds of a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia. nichia sts-da1-1102
-2- correspondence table of color coordinates ? luminous intensity ranks ranking by luminous intensity ranking by color coordinates u v w c, d e ? shaded ranks are available. 2.initial optical/electrical characteristics please refer to ?characteristics? on the following pages. 3.outline dimensions and materials please refer to ?outline dimensions? on the following page. 4.packaging the leds are packed in cardboard boxes after packaging in anti-electrostatic bags. please refer to ?packing? on the following pages. the label on the minimum packing unit shows ; part number, lot number, ranking, quantity in order to protect the leds from mechanical shock, we pack them in cardboard boxes for transportation. the leds may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. the boxes are not water resistant and therefore must be kept away from water and moisture. when the leds are transported, we recommend that you use the same packing method as nichia. 5.lot number the first six digits number shows lot number . the lot number is composed of the following characters; {? - ??? { - year ( 9 for 2009, a for 2010 ) ? - month ( 1 for jan., 9 for sep., a for oct., b for nov. ) - nichia's product number ??? - ranking by color coordinates, ranking by luminous intensity nichia sts-da1-1102
-3- 6.reliability (1) test items and results test item standard test method test conditions note number of damaged resistance to soldering heat jeita ed-4701 300 302 tsld=260 5c, 10sec. 3mm from the base of the epoxy bulb 1 time 0/50 temperature cycle jeita ed-4701 100 105 -40c ~ 25c ~ 100c ~ 25c 30min. 5min. 30min. 5min. 100 cycles 0/50 moisture resistance cyclic jeita ed-4701 200 203 25c ~ 65c ~ -10c 90%rh 24hrs./1cycle 10 cycles 0/50 terminal strength (bending test) jeita ed-4701 400 401 load 5n (0.5kgf) 0 ~ 90 ~ 0 bend 2 times no noticeable damage 0/50 terminal strength (pull test) jeita ed-4701 400 401 load 10n (1kgf) 10 1 sec. no noticeable damage 0/50 high temperature storage jeita ed-4701 200 201 ta=100c 1000hrs. 0/50 temperature humidity storage jeita ed-4701 100 103 ta=60c, rh=90% 1000hrs. 0/50 low temperature storage jeita ed-4701 200 202 ta=-40c 1000hrs. 0/50 steady state operating life ta=25c, i f =35ma 1000hrs. 0/50 steady state operating life of high humidity heat 60c, rh=90%, i f =20ma 500hrs. 0/50 steady state operating life of low temperature ta=-30c, i f =20ma 1000hrs. 0/50 (2) criteria for judging damage criteria for judgement item symbol test conditions min. max. forward voltage v f i f =10ma - u.s.l.*) 1.1 reverse current i r v r =5v - u.s.l.*) 2.0 luminous intensity i v i f =10ma l.s.l.**) 0.7 - *) u.s.l. : upper standard level **) l.s.l. : lower standard level nichia sts-da1-1102
-4- 7.cautions (1) lead forming when forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. do not use the base of the leadframe as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base may damage the led?s characteristics or it may break the leds. when mounting the leds onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the leds. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. (2) storage the leds should be stored at 30c or less and 70% rh or less after being shipped from nichia and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. the lead part may be affected by environments which contain corrosive substances. please avoid conditions which may cause the led to corrode, ta rnish or discolor. this corrosion or discoloration may cause difficulty during soldering operations. it is recommended that the leds be used as soon as possible. please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (3) recommended circuit in designing a circuit, the current through each led must not exceed the absolute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing through each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the current through the leds may vary due to the variation in forward voltage (v f ) of the leds. in the worst case, some led may be subjected to stresses in excess of the absolute maximum rating. this product should be operated in forward bias. a driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in led damage. (a) (b) ... ... nichia sts-da1-1102
-5- (4) static electricity static electricity or surge voltage damages the leds. it is recommended that a wrist band or an anti-electrostatic glove be used when handling the leds. all devices, equipment and machinery must be properly grounded. it is recommended that precautions be taken against surge voltage to the equipment that mounts the leds. when inspecting the final products in which leds were assembled, it is recommended to check whether the assembled leds are damaged by static electricity or not. it is easy to find static-damaged leds by a light-on test or a vf test at a lower current (below 1ma is recommended). damaged leds will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the leds do not light at the low current. criteria : (v f > 2.0v at i f =0.5ma) (5) soldering conditions solder the led no closer than 3mm from the base of the epoxy bulb. soldering beyond the base of the tie bar is recommended. recommended soldering conditions dip soldering hand soldering pre-heat pre-heat time solder bath temperature dipping time dipping position 120c max. 60 seconds max. 260c max. 10 seconds max. no lower than 3 mm from the base of the epoxy bulb. temperature soldering time position 350c max. 3 seconds max. no closer than 3 mm from the base of the epoxy bulb. although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the leds. a rapid-rate process is not recommended for cooling the leds down from the peak temperature. dip soldering should not be done more than one time. hand soldering should not be done more than one time. do not apply any stress to the lead particularly when heated. the leds must not be repositioned after soldering. after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature. direct soldering onto a pc board should be avoided. mechanical stress to the resin may be caused from warping of the pc board or from the clinching and cutting of the leadframes. when it is absolutely necessary, the leds may be mounted in this fashion but the customer will assume responsibility for any problems. direct solderi ng should only be done after testing has confirmed that no damage, such as wire bond failure or resin dete rioration, will occur. nichia?s leds should not be soldered directly to double sided pc boards because the heat will deteriorate the epoxy resin. when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the leds. nichia sts-da1-1102
-6- (6) heat generation thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric power is affected by the thermal re sistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. the operating current should be decided after considering the ambient maximum temperature of leds. (7) cleaning it is recommended that isopropyl alcohol be used as a solvent for cleaning the leds. when using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. freon solvents should not be used to clean the leds because of worldwide regulations. do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. before cleaning, a pre-test should be done to confirm whether any damage to the leds will occur. (8) safety guideline for human eyes the international electrical commission (iec) published in 2006 iec 62471: 2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep in mind that some countries and regions have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. following iec 62471:2006, most of nichia leds can be classified as belonging to either exempt group or risk group 1. optical characteristics of a led such as radiant flux, spectrum and light distribution are factors that affect the risk gr oup determination of the led. especially a high-power led, that emits light containing bl ue wavelengths, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which may greatly increase the hazard to your eyes. (9) others NSPE310S complies with rohs directive. if the leds are being used after being fixed into a case (container, box, etc...) the leds must not be mounted so that the epoxy lens is pressed or glued onto a plastic (or metal) board. flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. also, people should be cautious when using equipment that has had leds incorporated into it. these leds are designed and manufactured for standard applications of traffic signals. it is recommended to consult with nichia in advance if these leds are used for other applications. the customer shall not reverse engineer by disa ssembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the formal specifications must be exchanged and signed by both parties before large volume purchase begins. the appearance and specifications of the product may be modified for improvement without notice. nichia sts-da1-1102
-7- ? color coordinates measurement allowance is 0.012. ?? ici chromaticity diagram d c e 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x y 460 470 480 490 500 510 520 530 540 550 560 570 580 590 600 610 620 630 nichia sts-da1-1102
057071 ?? ta () ambient temperature ta () tavf 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -30 0 30 60 90 120 ?? ta () ambient temperature ta () ??-?R ambient temperature vs. forward voltage duty 10 100 1000 1 10 100 35 110 taiv 0.6 0.8 1.0 1.2 1.4 -60 -30 0 30 60 90 120 derating 0 10 20 30 40 50 0 30 60 90 120 (40,35) (85,8.5) ifiv 0 2 4 6 8 0 20 40 60 80 100 120 vfif 1 10 100 1000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 110 ?Rvf (v) forward voltage vf (v) ?R forward voltage vs. forward current ?`?` () duty ratio (%) ?`?`?S duty ratio vs. allowable forward current ?R vf (v) forward voltage vf (v) ta=25 ta=25 ta=25 (a.u.) relative luminosity (a.u.) ?(a.u.) relative luminosity(a.u.) - forward current vs. relative luminosity nspe310(s) ?/? characteristics model ? n o. nichia corporation ??I () title 100309 -8- ??- ambient temperature vs. relative luminosity ?? ta () ambient temperature ta () ??-S ambient temperaturevs. allowable forward current ifp (ma) forward current ifp (ma) ifp (ma) forward current ifp (ma) S ifp (ma) allowable forward current ifp (ma) S if ( ma ) allowable forward current if ( ma ) 10ma i fp = 10ma i fp = nichia sts-da1-1102
057081 directivity 90 80 70 60 50 40 30 20 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 L d (nm) dominant wavelength d (nm) L d (nm) dominant wavelength d (nm) ? directivity 0 1 0.5 0 0.5 1 nspe310(s) 100309 ?/? characteristics model ? n o. nichia corporation ??I () title -9- ifxy 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.00 0.05 0.10 0.15 0.20 0.25 0.30 x -?(L) forward current vs. chromaticity coordinate (d) y ta=25 ifd 491 494 497 500 503 506 509 1 10 100 1000 -L forward current vs. dominant wavelength spectrum 0.0 0.2 0.4 0.6 0.8 1.0 1.2 350 400 450 500 550 600 650 L (nm) wavelength (nm) k??? spectrum k? (a.u.) relative emission intensity (a.u.) tad 491 494 497 500 503 506 509 -60 -30 0 30 60 90 120 ?? ta () ambient temperature ta () ??-L ambient temperature vs. dominant wavelength ?(a.u.) relative luminosity(a.u.) ? radiation angle ta=25 ifp (ma) forward current ifp (ma) ta=25 10ma i fp = 10ma i fp = ta=25 10ma i f = 1ma(505nm) 5ma(502nm) 10ma(500nm) 35ma(496nm) 110ma(493nm) 110 nichia sts-da1-1102
? item ? resin `??` leadframe ?? epoxy resin | materials y? U?`?? ag plating iron solder-dipped leads (lead-free) NSPE310S stsz-h057091 -10- 0.2 ??I () nichia corporation title ? no. ? outline dimensions mm model unit g allow ?1 (note1) `??????? ?led???? ??`?? ? ?? ?QH???? please note that the bare iron showing at the cut end of the lead frame may be corroded under certain conditions. leds have some sharp edges and points, particularly lead frames . please handle with care so as to avoid injuries. ?2 (note2) ?????????? no noticeable exposure of base coat for the leads with solder-d ipped finishes. ???`? detail of stopper 1 0.3 0.3 3.5 1 (2) (2.5) 1.1 anode cathode 0.5 +0.1 -0.05 10.4 0.5 4.4 5.4 26.9 1 3.1 3.8 3max. not soldered 1.5max. nichia sts-da1-1102
-11- ?`? cardboard box 3601352154t ?` cardboard ?` cardboard ? print ??d the quantity is printed on this bag. ?`? cardboard box b 3601352154t ?` cardboard cardboard box a ?` cardboard ?? anti-electrostatic bag ??d? the quantity is printed on this bag. ? print ? label ? label nxpxxxxxx 090113833712 nxpxxxxxx 090113833722 18 ?? one box contains 8 bags at maximum. ? 2???? the cardboard box b contains 2 cardboard box a at maximum. y? packing model title ? no. ??I () nichia corporation y? packing model title ? no. ??I () nichia corporation nxpxxxxxx xxxx led nxpxxxxxx xxxx led ?? anti-electrostatic bag ??N? this label is placed on the cardboard box b. nxpxxxxxx xxxx led n i c h i a caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs type lot qty pcs xxxxxx- nxpxxxxxx xxxx led n i c h i a caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs type lot qty pcs xxxxxx- type lot qty. pcs nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xxxxxx- type lot qty. pcs nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xxxxxx- nichia sts-da1-1102
-12- ? label ?? anti-electrostatic bag ?`? cardboard box 4251353554t ?` cardboard ?` cardboard ? print ??d? the quantity is printed on this bag. ?`? cardboard box b 4251353554t ?` cardboard cardboard box a ?` cardboard ?? anti-electrostatic bag ??d the quantity is printed on this bag. ? print nxpxxxxxx 090413833733 ? label nxpxxxxxx 090113833742 ?4 ???? the cardboard box b contains 4 cardboard box a at maximum. 120?? one box contains 20 bags at maximum. y? packing model title ? no. ??I () nichia corporation y? packing model title ? no. ??I () nichia corporation ??N? this label is placed on the cardboard box b. nxpxxxxxx xxxx led n i c h i a caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs type lot qty pcs xxxxxx- nxpxxxxxx xxxx led n i c h i a caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs type lot qty pcs xxxxxx- nxpxxxxxx xxxx led type lot qty. pcs nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xxxxxx- nxpxxxxxx xxxx led type lot qty. pcs nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs xxxxxx- nichia sts-da1-1102

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